BGA Soldering in NTI
NTI insists on variety of broad and comprehensive soldering services for our clients. We provide Ball Grid Array soldering services in the highest levels and become more professional with regard to all developments and required knowledge on an on-going basis, in order to achieve good and high-quality Ball Grid Array soldering. These kind of BGA soldering services are reliably provided for various industries that require high-quality, very durable BGA soldering services.
Ball Grid Array Soldering solution
NTI provides a various soldering techniques and performances, that qualify with market demand for BGA soldering for devices and printed circuits in high density, as complicated as may be.
In NTI, each soldering project becomes possible and practical with variety of tools and strict implemented procedures, and therefore maintaining soldering quality time after time.
Being strict with procedures and planning the right soldering stages, increasing success rate and significantly reducing any fails or malfunction that may occur during this kind of soldering. Ball Grid Array Soldering processes position NTI as one of the most professional soldering services company in today’s market.
NTI maximizes BGA soldering process
In NTI we specialize in finding simple modes of action and solving every problem may occur every once in a while, in this kind of soldering. We have both broad knowledge and a lot of experience to execute soldering project while considering all relevant parameters such as:
- Strength and durability of soldering connections
- Component’s optimal flatness
- Variety of soldering materials that are suitable for a various range of components and soldering
- Strong and stable contacts
- Reducing waste by planning and performing in a precise and professional manner
Complicated BGA soldering with NTI
We make every soldering a simple one by having a precise planning of the suitable soldering
material, strengthening connection points, using suitable equipment and qualified, very experienced in BGA soldering, team.
In every soldering we perform X-RAY inspection and by doing so, we supervise and examine the performances and quality of each soldering. Therefore, we provide our clients with high abilities for every product that needs to maximize BGA soldering features of high density printed circuits, in every stage of the product.
We monitor and sample soldering results for our clients during the entire process and in each and every different stage, from developing until production. WE provide full transparency of our quality control and strict working procedures in our company. We insist that all soldering will present strength, great results and high-quality connections with long lasting durability.